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service Device Model
HN-Y6234V2
platform
AMD AI Computing service device standard system platform
processor
supports AMD EPYC 7002&7003 series Unlocked processor
chipset
based on AMD EPYC 7002&7003 series processor Build
Memory Standard
supports octa-channel DIMM DDR4 3200/2933/2666/2400/2133MHz spec server memory (depends on CPU), max support 2TB
graphics card
Aspeed AST2500 BMC Controller-1x DisplayPort 1.1a with max.resolution up to 1920x1200 @ 60Hz
Power Supply
can Select GRPS800W-3200W Power Supply, supports N+M Redundant
NIC
2 Intel I266V 2.5G, 1 x IPMI remote management port (requires BMC module to enable use) Realtek RTL8201F
Storage
supports 4 x 3.5 inch hard drive, supports 4/2.5 inch hard drive SSD SSD Drive, 3 x M.2 2280 NVME PCIExpress4.0x4
I/O port
4 x USB3.2 Gen1 port, 2 x USB2.0 port, 3 x RJ45 LAN port, 1 x 2 -hole audio port, 1 x VGA port
RAID supports
does not support RAID, requires additionally Add Separately
work Environment
operating temperature:0°C~55°℃(32°F~131°F) work Humidity:10%-95% @40°C Non-Condensing
Chassis parameters
Color: Black, Material: SGCC Galvanized Steel, cooling Thermal: 3 x Active Fan cooling Thermal, Complete System dimensions::650(L)*437.6(w)*176(H)
Ordering Information
standard
standard system platform: system Chassis +3*12038 Thermal header Removable Fan + Redundant Power Supply +CPU cooler + Stress Test
can Select configuration
CPU: 7002&7003 series can Select
memory: ECC server memory can Select
graphics card: multiple types single-width full high full-length mainstream AI graphics card card can Select
hard drive: supports 4 x SATA3.0 6Gbps HDD port, 3 x SFF-8643 supports expand 12 x SATA3.0 6Gbps hard drive or 3 x PCIE4.0 x4 U.2 hard drive
OEM service
provide solution customized service
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User Manual
Installation Video
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HN-Y6234V2
· balanced architecture, outstanding performance: max support 4 single-width full-height full-length GPU through-hole, reduces latency and bandwidth bottlenecks, significantly boosts heterogeneous computing
· rich ecosystem, system optimization: supports various mainstream AI acceleration card and leading deep learning framework, flexibly adapted to business scenarios
· flexible configuration, easy maintenance: modular redundant design, most components tool-free serviceable, quick assembly/disassembly, reduced maintenance time
· high performance: designed for heavy-load graphics processing tasks, configuration high-performance GPU, specifically as computing intensive applications, such as deep learning, 3D rendering, scientific simulation and video editing etc. direction
· compute density: internal max support multiple 4 GPU through-hole, as needs scenarios provides high-density computing with and expansion capability
· high bandwidth, low latency: onboard dual 2.5G high-speed NIC, with supports high-bandwidth, low-latency data transfer
· application areas: widely applicable to AI, high-performance computing, data analysis, depending on Frequency Analysis, FX Fluid Dynamics computing simulation etc. various type AI computing simulation platform should using scenarios
